谁能解释一下 英文缩写和中文意思。像是着是 mhz ghz 等等！

1、cpu3dnow!（3d no waiting，无须等待的3d处理）aam（amd analyst meeting，amd分析家会议）abp（advanced branch prediction，高级分支预测）acg（aggressive clock gating，主动时钟选择）a**（alternate instruction set，交替指令集）alat（advanced load table，高级载入表）alu（arithmetic logic unit，算术逻辑单元）aluminum（铝）agu（address generation units，地址产成单元）apc（advanced power control，高级能源控制）apic（advanced rogrammable interrupt controller，高级可编程中断**）aps（alternate phase shifting，交替相位跳转）a**（advanced system buffering，高级系统缓冲）atc（advanced transfer cache，高级转移缓存）atd（assembly technology development，装配技术发展）bbul（bumpless build-up layer，内建非凹凸层）bga（ball grid array，球状网阵排列）bht（branch prediction table，分支预测表）bops（billion operations per second，10亿操作/秒）bpu（branch processing unit，分支处理单元）bp（brach pediction，分支预测）bsp（boot strap processor，启动捆绑处理器）btac（branch target address calculator，分支目标寻址计算器）cbga (ceramic ball grid array，陶瓷球状网阵排列)cdip (ceramic dual-in-line，陶瓷双重直线)center processing unit utilization，中央处理器占用率cfm（cubic feet per minute，立方英尺/秒）cmt（course-grained multithreading，过程消除多线程）cmos（complementary metal oxide semiconductor，互补金属氧化物半导体）cmov（conditional move instruction，条件移动指令）c**c（complex instruction set computing，复杂指令集计算机）clk（clock cycle，时钟周期）cmp（on-chip multiprocessor，片内多重处理）cms（code morphing software，代码变形软件）co-cpu（cooperative cpu，协处理器）cob（cache on board，板上集成缓存，做在cpu卡上的二级缓存，通常是内核的一半速度））cod（cache on die，芯片内核集成缓存）copper（铜）cpga（ceramic pin grid array，陶瓷针型栅格阵列）cpi（cycles per instruction，周期/指令）cpld（complex programmable logic device，复杂可程式化逻辑元件）cpu（center processing unit，中央处理器）crt（cooperative redundant threads，协同多余线程）csp（chip scale package，芯片比例封装） cxt（chooper extend，增强形k6-2内核，即k6-3）data forwarding（数据前送）db（decibel，分贝）dclk（dot clock，点时钟）dct（dram controller，dram**）ddt（dynamic deferred transaction，动态延期处理）decode（指令解码）dib（dual independent bus，双重独立总线）dmt（dynamic multithreading architecture，动态多线程结构）dp（dual processor，双处理器）dsm（dedicated stack manager，专门堆栈管理）dsmt（dynamic simultaneous multithreading，动态同步多线程）dst（depleted substrate trans**tor，衰竭型底层晶体管）dtv（dual threshold voltage，双重极限电压）duv（deep ultra-violet，纵深紫外光）ebga（enhanced ball grid array，增强形球状网阵排列）ebl（electron beam lithography，电子束平版印刷）ec（embedded controller，嵌入式**）edec（early decode，早期解码）embedded chips（嵌入式）epa（edge pin array，边缘针脚阵列）epf（embedded processor forum，嵌入式处理器论坛）epl（electron projection lithography，电子发射平版印刷）epm（enhanced power management，增强形能源管理）epic（explicitly parallel instruction code，并行指令代码）euv（extreme ultra violet，紫外光）euv（extreme ultr**iolet lithography，极端紫外平版印刷）fadd（floationg point addition，浮点加）fbga（fine-pitch ball grid array，精细倾斜球状网阵排列）fbga（flipchip bga，轻型芯片bga）fc-bga（flip-chip ball grid array，反转芯片球形栅格阵列）fc-lga（flip-chip land grid array，反转接点栅格阵列）fc-pga（flip-chip pin grid array，反转芯片针脚栅格阵列）fdiv（floationg point divide，浮点除）femms：fast entry/exit ** state，快速进入/退出多媒体状态fft（fast fourier transform，快速热欧姆转换）fgm（fine-grained multithreading，高级多线程）fid（fid：frequency identify，频率鉴别号码）fifo（first input first output，先入先出队列）f**c（fast instruction set computer，快速指令集计算机）flip-chip（芯片反转）flops（floating point operations per second，浮点操作/秒）fmt（fine-grained multithreading，纯消除多线程）fmul（floationg point multiplication，浮点乘）fprs（floating-point reg**ters，浮点寄存器）fpu（float point unit，浮点运算单元）fsub（floationg point subtraction，浮点减）gfd（gold finger device，金手指超频设备）ghc（global h**tory counter，通用历史计数器）gtl（gunning transceiver logic，射电收发逻辑电路）gvpp（generic v**ual perception processor，常规视觉处理器）hl-pbga: 表面黏著,高耐热、轻薄型塑胶球状网阵封装htt（hyper-threading technology，超级线程技术）hz（hertz，赫兹，频率单位）ia（intel architecture，英特尔架构）iaa（intel application accelerator，英特尔应用程序加速器）icu（instruction control unit，指令控制单元）id（identify，鉴别号码）idf（intel developer forum，英特尔开发者论坛）ieu（integer execution units，整数执行单元）ihs（integrated heat spreader，完整热量扩展）ilp（instruction level parallel**m，指令级平行运算）imm: intel mobile module, 英特尔移动模块instructions cache，指令缓存instruction coloring（指令分类）iops（integer operations per second，整数操作/秒）ipc（instructions per clock cycle，指令/时钟周期）**a（instruction set architecture，指令集架构）**d（inbuilt speed-throttling device，内藏速度控制设备）itc（instruction trace cache，指令追踪缓存）itrs（international technology roadmap for semiconductors，国际半导体技术发展蓝图）kni（katmai new instructions，katmai新指令集，即sse）latency（潜伏期）ldt（lightning data transport，闪电数据传输总线）lfu（legacy function unit，传统功能单元）lga（land grid array，接点栅格阵列）ln2（liquid nitrogen，液氮）local interconnect（局域互连）mac（multiply-accumulate，累积乘法）mbga (micro ball grid array，微型球状网阵排列)nm（namometer，十亿分之一米/毫微米）mca（machine check architecture，机器检查体系）mcu（micro-controller unit，微**单元）mct（memory controller，内存**）mesi（modified, exclusive, shared, invalid：修改、排除、共享、废弃）mf（microops fusion，微指令合并）mm（micron metric，微米）mmx（** extensions，多媒体扩展指令集）mmu（** unit，多媒体单元）mmu（memory management unit，内存管理单元）mn（model numbers，型号数字）mflops（million floationg point/second，每秒百万个浮点操作）mhz（megahertz，兆赫）mil（pcb 或晶片布局的长度单位，1 mil = 千分之一英寸）mips（million instruction per second，百万条指令/秒）moesi（modified, owned, exclusive, shared or invalid，修改、自有、排除、共享或无效）mof（micro ops fusion，微操作熔合）mops（million operations per second，百万次操作/秒）mp（multi-processing，多重处理器架构）mpf（micro processor forum，微处理器论坛）mpu（microprocessor unit，微处理器）mps（multiprocessor specification，多重处理器规范）msrs（model-specific reg**ters，特别模块寄存器）msv（multiprocessor specification version，多处理器规范版本）naoc（no-account overclock，无效超频）ni（non－intel，非英特尔）nop（no operation，非操作指令）nre（non-recurring engineering charge，非重复性工程费用）obga（organic ball grid arral，有机球状网阵排列）ocpl（off center parting line，远离中心部分线队列）olga（organic land grid array，有机平面网阵包装）ooo（out of order，乱序执行）opc（optical proximity correction，光学临近修正）opga（organic pin grid array，有机塑料针型栅格阵列）opn（ordering part number，分类零件号码）pat（performance acceleration technology，性能加速技术）pbga（plastic pin ball grid array，塑胶球状网阵排列）pdip (plastic dual-in-line，塑料双重直线)pdp（parallel data processing，并行数据处理）pga（pin-grid array，引脚网格阵列）,耗电大plcc (plastic leaded chip carriers，塑料行间芯片运载)post-r**c（加速r**c，或后r**c）pr（performance rate，性能比率）pib（processor in a box，盒装处理器）pm（pseudo-multithreading，假多线程）ppga（plastic pin grid array，塑胶针状网阵封装）pqfp（plastic quad flat package，塑料方块平面封装）psn（processor serial numbers，处理器序列号）qfp（quad flat package，方块平面封装）qsps（quick start power state，快速启动能源状态）ras（return address stack，返回地址堆栈）raw（read after write，写后读）ree（rapid execution engine，快速执行引擎）reg**ter contention（抢占寄存器）reg**ter pressure（寄存器不足）reg**ter renaming（寄存器重命名）remark（芯片频率重标识）resource contention（资源冲突）retirement（指令引退）r**c（reduced instruction set computing，精简指令集计算机）rob（re-order buffer，重排序缓冲区）rse（reg**ter stack engine，寄存器堆栈引擎）rtl（reg**ter transfer level，暂存器转换层。硬体描述语言的一种描述层次）sc242（242-contact slot connector，242脚金手指插槽连接器）se（special embedded，特别嵌入式）sec（single edge connector，单边连接器）secc（single edge contact cartridge，单边接触卡盒）sepp（single edge processor package，单边处理器封装）shallow-trench **olation（浅槽隔离）simd（single instruction multiple data，单指令多数据流）sio2f（fluorided silicon oxide，二氧**）smi（system management interrupt，系统管理中断）smm（system management mode，系统管理模式）smp（symmetric multi-processing，对称式多重处理架构）smt（simultaneous multithreading，同步多线程）soi（silicon-on-insulator，绝缘体硅片）soic (plastic small outline，塑料小型)sonc（system on a chip，系统集成芯片）spga（staggered pin grid array、交错式针状网阵封装）spec（system performance evaluation corporation，系统性能评估测试）sqrt（square root calculations，平方根计算）srq（system request queue，系统请求队列）sse（streaming simd extensions，单一指令多数据流扩展）sff（small form factor，更小外形格局）ss（special sizing，特殊缩放）ssp（slipstream processing，滑流处理）sst（special sizing techniques，特殊筛分技术）ssop (shrink plastic small outline，缩短塑料小型)stc（space time computing，空余时间计算）superscalar（超标量体系结构）tap（test access port，测试存取端口）tbga（tie ball grid array，带状球形光栅阵列）tcp: tape carrier package（薄膜封装）,发热小tdp（thermal design power，热量设计功率）throughput（吞吐量）tlb（translate look side buffers，转换旁视缓冲器）tlp（thread-level parallel**m，线程级并行）tmp（threaded multi-path，线程多通道）tpi（true performance initiative/index，真实性能为先/指标）tqfp (thin plastic quad flat pack，薄型方面平面封装)trc（row cycle time，列循环时间）trd（trans**tor density，晶体管密度）tsop（thin small outline plastic，薄型小型塑料）uswc（uncacheabled speculative write combination，无缓冲随机联合写操作）valu（vector arithmetic logic unit，向量算术逻辑单元）vfsd（vertex frequency stream divider，顶点频率流分隔）vid（vid：voltage identify，电压鉴别号码）vliw（very long instruction word，超长指令字）vpu（vector permutate unit，向量排列单元）vpu（vector processing units，向量处理单元，即处理mmx、sse等simd指令的地方）vsa（virtual system architecture，虚拟系统架构）vtf（via technical forum，威盛技术论坛）xbar（cros**ar，交叉口闩仲载逻辑单元）xp（experience，体验）xp（extra performance，额外性能）xp（extreme performance，极速性能）散热器tft（tiny fin technology，微型鳍片技术）2、主板3gio（third generation input/output，第三代输入输出技术）acr（advanced communications r**er，高级通讯升级卡）adimm（advanced dual in-line memory modules，高级双重内嵌式内存模块）agtl+（ass**ted gunning transceiver logic，援助发射接收逻辑电路）ahci（advanced host controller interface，高级主机**接口）aimm（agp inline memory module，agp板上内存升级模块）amr（audio／modem r**er；音效／调制解调器主机板附加直立插卡）aha（accelerated hub architecture，加速中心架构）aoi（automatic optical inspection，自动光学检验）apu（audio processing unit，音频处理单元）arf（asynchronous receive fifo，异步接收先入先出）asf（alert standards forum，警告标准讨论）ask ir（amplitude shift keyed infra-red，长波形可移动输入红外线）at（advanced technology，先进技术）atx（at extend，扩展型at）bios（basic input/output system，基本输入/输出系统）cnr（communication and netwo**ng r**er，通讯和网络升级卡）csa（communication streaming architecture，通讯流架构）cse（configuration space enable，可分配空间）coast（cache-on-a-stick，条状缓存）dasp（dynamic adaptive speculative pre-processor，动态适应预测预处理器）db: device bay，设备插架dmi（desktop management interface，桌面管理接口）dot（dynamic overclocking technonlogy，动态超频技术）dpp（direct print protocol，直接打印协议drcg（direct rambus clock generator，直接rambus时钟发生器）dvmt（dynamic video memory technology，动态视频内存技术）e（economy，经济，或entry-level，入门级）eb（expansion bus，扩展总线）efi（extensible firmware interface，扩展固件接口）ehci（enhanced host controller interface，加强型主机端控制接口）e**a（enhanced industry standard architecture，增强形工业标准架构）emi（electromagnetic interference，电磁干扰）escd（extended system configuration data，可扩展系统配置数据）esr（equivalent series res**tance，等价系列电阻）fbc（frame buffer cache，帧缓冲缓存）firewire（火线，即ieee1394标准）flexatx（flexibility atx，可扩展性atx）f**（front side bus，前端总线）fwh（firmware hub，固件中心）gb（garibaldi架构，garibaldi基于atx架构，但是也能够使用wtx构架的机箱）gmch（graphics & memory controller hub，图形和内存控制中心）gpa（graphics performance accelerator，图形性能加速卡）gp**（general purpose inputs，普通操作输入）gtl+（gunning transceiver logic，发射接收逻辑电路）hdit（high bandwidth differential interconnect technology，高带宽微分互连技术）hslb（high speed link bus，高速链路总线）ht（hypertransport，超级传输）i2c（inter-ic）i2c（inter-integrated circuit，内置集成电路）ia（instantly **ailable，即时可用）ibases（intel baseline agp system evaluation suite，英特尔基线agp系统评估套件）ic（integrate circuit，集成电路）ich（input/output controller hub，输入/输出控制中心）ich-s（ich-hance rapids，ich高速型）icp（integrated communications processor，整合型通讯处理器）iha（intel hub architecture，英特尔hub架构）imb（inter module bus，隐藏模块总线）intin（interrupt inputs，中断输入）ipmat（intel power management analys** tool，英特尔能源管理分析工具）ir（infrared ray，红外线）irda（infrared ray，红外线通信接口，可进行局域网存取和文件共享）**a（industry standard architecture，工业标准架构）**a（instruction set architecture，工业设置架构）k8htb（k8 hypertransport bridge，k8闪电传输桥）lsi（large scale integration，大规模集成电路）lpc（low pin count，少针脚型接口）mac（media access controller，媒体存储**）mba（manage boot agent，管理启动代理）mc（memory controller，内存**）mca（micro channel architecture，微通道架构）mch（memory controller hub，内存控制中心）mdc（mobile daughter card，移动式子卡）mii（media independent interface，媒体独立接口）mio（media i/o，媒体输入/输出单元）mosfet（metallic oxide semiconductor field effecttrans**tor，金属氧化物半导体场效应晶体管）mrh-r（memory repeater hub，内存数据处理中心）mrh-s（sdram repeater hub，sdram数据处理中心）mrimm（media-rimm，媒体rimm扩展槽）msi（** signaled interrupt，信息信号中断）mspce(multiple streams with pipelining and concurrent execution，多重数据流的流水线式传输与并发执行）mt=megatransfers（兆传输率）mth（memory transfer hub，内存转换中心）mutiol（multi-threaded i/o link，多线程i/o链路）ncq（native command qu，本地命令序列）ngio（next generation input/output，新一代输入/输出标准）nppa（nforce platform processor architecture，nforce**处理架构）ohci（open host controller interface，开放式主**接口）orb（operation request block，操作请求块）ors（over reflow soldering，再流回焊接，smt元件的焊接方式）p64h（64-bit pci controller hub，64位pci控制中心）pcb（printed circuit board，印刷电路板）pcba（printed circuit board assembly，印刷电路板装配）pci（peripheral component interconnect，互连外围设备）pci sig（peripheral component interconnect special interest group，互连外围设备专业组）pdd（performance driven design，性能驱动设计）phy（port physical layer，端口物理层）post（power on self test，加电自测试）ps/2（personal system 2，第二代个人系统）pth（plated-through-hole technology，镀通孔技术）re（read enable，可读取）qp（quad-pumped，四倍泵）rbb（rapid bios boot，快速bios启动）rng（random number generator，随机数字发生器）rtc（real time clock，实时时钟）kbc（keybroad control，键盘**）sap（sideband address port，边带寻址端口）**a（side band addressing，边带寻址）**c（single board computer，单板计算机）**p-2（serial bus protocol 2，第二代串行总线协协）sci（serial communications interface，串行通讯接口）sck (cmos clock，cmos时钟)sdu（segment data unit，分段数据单元）sff（small form factor，小尺寸架构）sfs（stepless frequency selection，步进频率选项）sma（share memory architecture，共享内存结构）smt（surface mounted technology，表面黏贴式封装）spi（serial peripheral interface，串行外围设备接口）ssll（single stream with low latency，低延迟的单独数据流传输）std（suspend to d**k，磁盘唤醒）str（suspend to ram，内存唤醒）svr（switching voltage regulator，交换式电压调节）tht（through hole technology，插入式封装技术）uchi（universal host controller interface，通用宿主**接口）upa（universal platform architecture，统一**架构）updg（universal platform design guide，统一**设计导刊）usart（universal synchronous asynchronous receiver transmitter，通用同步非同步接收传送器）u**（universal serial bus，通用串行总线）usdm（unified system diagnostic manager，统一系统监测管理器）vid（voltage identification definition，电压识别认证）vlb（video electronics standards association local bus，视频电子标准协会局域总线）vlsi（very large scale integration，超大规模集成电路）vmap（via modular architecture platforms，via模块架构**）v**（v standby，待命电压）vxb（virtual extended bus，虚拟扩展总线）vrm（voltage regulator module，电压调整模块）wct（wireless connect technology，无线连接技术）we（write enalbe，可写入）ws（w**e soldering，波峰焊接，tht元件的焊接方式）xt（extended technology，扩充技术）zif（zero insertion force, 零插力插座）芯片组acpi（advanced configuration and power interface，先进设置和电源管理）agp（accelerated graphics port，图形加速接口）bms（blue magic slot，蓝**法槽）i/o（input/output，输入/输出）mioc: memory and i/o bridge controller，内存和i/o桥**nbc: north bridge chip（北桥芯片）piix: pci **a/ide accelerator（加速器）pse36: page size extension 36－bit，36位页面尺寸扩展模式pxb: pci expander bridge，pci增强桥rcg: ras/cas generator，ras/cas发生器**c: south bridge chip（南桥芯片）smb（system management bus，全系统管理总线）spd（serial presence detect，连续存在检测装置）s**: super south bridge，超级南桥芯片tdp: triton data path（数据路径）tsc: triton system controller（系统**）qpa: quad port acceleration（四接口加速）主板技术gigabyteacops: automatic cpu overheat prevention system（cpu过热预防系统）siv: system **rmation viewer（系统信息观察）磐英esdj（easy setting dual jumper，简化cpu双重跳线法）浩鑫upt（u**、panel、link、tv-out四重接口）华硕c.o.p（cpu overheating protection，处理器过热保护） 3、显示设备ad（analog to digitalg，模拟到数字转换）adc（apple d**play connector，苹果专用显示器接口）agc（anti glare coatings，防眩光涂层）amr（ati multi-rendering technology，ati多重渲染技术）asic（application specific integrated circuit，特殊应用积体电路）asc（auto-sizing and centering，自动调效屏幕尺寸和中心位置）asc（anti static coatings，防静电涂层）asd（auto stereoscopic d**play，自动立体显示）ag（aperture grills，栅条式金属板）arc（anti reflect coating，防反射涂层）bla: bearn landing area（电子束落区）bmc（black matrix screen，超黑矩阵屏幕）ccs（cross capacitance sensing，交叉电容感应）cd/m^2（candela/平方米，亮度的单位）cdrs（curved directional reflection screen，曲线方向反射屏幕）cg-silicon（continuous grain silicon，连续微粒硅）cnt（carbon nano-tube，碳微管）crc（cyclical redundancy check，循环冗余检查 20210311